Merritronix

UPCOMING

IPO Date: 1 Jun - 3 Jun 2026

Listing Date: 8 Jun 2026

Price Range

₹141 to ₹149

Issue Size

70 Cr

Min Investment

₹1,41,000

Lot Size

1000 Shares

View IPO Document

Schedule of Merritronix

Issue open date

1 Jun 2026

Issue close date

3 Jun 2026

UPI mandate deadline

3 Jun 2026 (5 PM)

Allotment finalization

4 Jun 2026

Share credit

5 Jun 2026

Listing date

8 Jun 2026

Mandate end date

18 Jun 2026

Issue size

Funds Raised in the IPOAmount
Overall70 Cr
Fresh Issue0.47 Cr
Offer for Sale0 Cr

Allotment DetailsNew

Allotment TimelineDetails
Allotment Date4 Jun 2026
Allotment Link{Link}

Grey Market PremiumNew

Grey Market Premium (GMP) is the premium at which the shares are traded in the grey market. It gives a fair idea about the listing price of the IPO shares. The GMP can be positive or negative based on the demand and supply of the shares in the grey market.

DateIpo PriceGMPEstimated Listing Price
22 May 2026₹149₹0₹149 (0%)

Performance Merritronix

Issue PriceListing GainCurrent Market PriceP/L
₹141 to ₹149............

About Merritronix

Merritronix Limited is an Electronics Systems Design and Manufacturing (ESDM) company engaged in manufacturing high-reliability electronic assemblies and systems for defence, aerospace, telecommunications and specialised industrial sectors. The company operates on a B2B business model and provides services such as component sourcing, PCB assembly, system integration, testing and box-build solutions. Its manufacturing capabilities include Surface-Mount Technology (SMT), Through-Hole Technology (THT) assembly and turnkey manufacturing for mission-critical applications. The company also earns revenue from job work services, trading sales and obsolescence management for legacy electronic systems. Over the years, Merritronix has expanded from telecom component supply into defence and aerospace electronics manufacturing.

Founded in1988
Managing directorMr.Dovari Amarnath
Parent organization

Financial Overview

Strengths

  • Strong presence in defence and aerospace electronics sectors with high entry barriers.
  • Integrated ESDM capabilities including SMT, THT assembly, testing and system integration.
  • Diversified revenue streams from turnkey manufacturing, job work and obsolescence management.
  • Experience in handling mission-critical and high-reliability electronic products.

Risks

  • High dependence on defence and government-related orders.
  • Rapid technological changes and electronic component obsolescence risk.
  • Supply-chain disruptions and semiconductor shortages may impact production.
  • Strict compliance and quality certification requirements increase operational complexity.

Subscription Figures

CategorySubscription (No. of times)
Qualified Institutional Buyers (QIBs)N/A
Non-Institutional Investors (NIIs)N/A
Retail Individual Investors (RIIs)N/A
EmployeeN/A
TotalN/A